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公司名录
THERMALSOFT
公司名称:
企业名称:
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THERMALSOFT
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公司说明:
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公司介绍:
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thermal software for electronics cooling:
analysis of circuit boards (pcb), modeling of heat sinks (heatsinks),
semiconductor stackups (qfp, bga), duty cycle transient problems,
boxes, enclosures and systems
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关键字搜索:
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thermal software thermalsoftware modeling
design analysis
program thermal modeling design analysis software program intermittent duty
heat sink heatsink circuit board pcb pc semiconductor enclosure system
component pcb bga qfp dpak d2pak to-220 to-3 to-218 igbt dip cpu
thermal resistance thermal resistance theta temperature conduction
convection radiation heat transfer forced convection natural convection
gray radiation view factor shape factor temperature 3d software fin
efficiency cooling duty cycle duty cycle thermal via solder nonlinear
thermal conductivity emissivity specific heat ambient temperature turbulence
free free power thermal interface resistance blackbody thermal resistance
boundary steady state transient duty cycle fan blower modelling thermo
conduct air thermal management thermal simulation thermal fea fem finite
element cfd computational fluid dynamics sinda flotherm cad cam
autocad ptc parametric technology saber analogy proengineer software package
program computer thermal thermal heat flow gray radiation heat sink
turbulence boundary layer fan curve cfm heat transfer coefficient node
resistor fluid flow thermal management junction case chip electronic
power supply automotive abs stackup diode power transistor
dissipation theta data free free free software free program silicon copper
alumina ceramic extrusion spreader sip gaas intel motorola pentium casting
anodize grease pad motor control thermally conductive cold plate flip-chip
module pressure drop pin fin
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公司地址:
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4521WarrenAve.,HOTSPRINGSNATIONALPARK,AR,USA
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邮政编码:
邮政编码:
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71901
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电话号码:
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5016239918 (+1-501-623-9918)
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传真号码:
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5016230005 (+1-501-623-0005)
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网址:
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thermalsoft. com
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电子邮件:
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美国SIC代码(标准工业分类代码) :
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9999
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美国的SIC描述:
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Unclassified
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员工人数:
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销售金额:
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信用记录:
信用报告:
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联系人:
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Remove my name
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公司新闻:
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